PROPERTIES OF SUNFLOWER HUSK PARTICLEBOARD GLUED WITH POLYMERIC DIPHENYLMETHANE DIISOCYANATE ADHESIVE

Abstract

This study investigates the suitability of sunflower husks as an alternative raw material for the production of particleboards. For this purpose, shredded sunflower husks bonded with 5% polymeric diphenylmethane diisocyanate (pMDI) were used. Single-layer particleboards were manufactured at three density levels: 800, 850, and 900 kg·m⁻³. The physical and mechanical properties of the boards were evaluated, including modulus of rupture, modulus of elasticity, internal bond strength, screw withdrawal resistance, water absorption, and thickness swelling after 24 h of water immersion. The results indicate that increasing board density leads to improved mechanical properties. The manufactured boards meet the requirements of EN 312 for board types P2 and P3. In addition, the use of pMDI adhesive contributes to reduced water absorption and low thickness swelling.